0.12mm Pitch BGA Reballing Stencil with IC Slots Soldering Rework Template Phone Repair

Label:Yes 1.Compatible with A53 & A536 Series:CPU tin plating stencil is applicable to A53 and for A536 series with 0.12mm pitch. 2.Stable Under Heat & Efficient Tinning:The stencil maintains dimensional stability under high temperatures and enables fast solder application, helping improve rework efficiency. 3.Half-Engraved IC Recesses:The tin stencil is equipped with multiple IC recess on the stencil body with half engraving process, which effectively avoids small IC from sticking to tin and protecting small IC from breaking corners. 4.Accurate Alignment & Compact Design:Allows precise positioning during use and features a space-saving form factor suitable for various repair scenarios. 5.Portable & User-Friendly:CPU tin plating stencil is very portable, this stencil offers convenient operations for both professional maintenance and DIY repairs.

Specifications: Item Type: Phone Tin Reballing Stencil Pitch: Approx. 0.12mm / 0.005in Size: 10 * 8cm/3.94 * 3.15in Color: Silver White Applicable Models: Suitable for A33 A53 A536 A13 A21S F13 M33, etc.

Package List: 1 x Phone Tin Reballing Stencil

Note: 1. Due to the difference between different monitors, the picture may not reflect the actual color of the item. 2. Please allow slight dimension difference due to different manual measurements. Thank you for your understanding.