Feature:
1. Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
2. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
3. Perfect Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60?A90 series, A10S, A605F, A705F and more.
4. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using.
5. Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU.
Applicable Product Model: For A60A90 series, A10S, A605F, A705F, A920F. .
Package List:
1 x
Phone CPU BGA Reballing StencilQuick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
Perfect Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60?A90 series, A10S, A605F, A705F and more.
Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using.
Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
