TO247 Transistor Heat Conduction Gasket: 1mm Aluminum Nitride Ceramic Sheet with High Thermal Conductivity

This high-performance heat conduction gasket is crafted from a 1mm aluminum nitride ceramic sheet, renowned for its exceptional thermal conductivity. Designed specifically for TO247 transistors, it effectively manages and dissipates heat, ensuring optimal performance and longevity of electronic components. Durable and reliable, this gasket offers a superior thermal management solution for demanding applications. Characteristic: Aluminum nitride ceramic sheet Function: Thermally Conductive Aluminum Nitride Ceramic Sheet Microstructure: Polycrystalline Specifications and dimensions: 17*22*1 Thermal conductivity: 180W/m.k Insulation strength: 17KV/MM Manufacture country: China Instructions included: No