High-Efficiency 0.7mm Aluminum Nitride Thermal Conductive Ceramic Heat Dissipation Pad

This high-performance heat dissipation pad is designed for efficient thermal management in electronic applications. With a thickness of 0.7mm, it is crafted from aluminum nitride ceramic, known for its excellent thermal conductivity properties. This pad effectively transfers heat away from sensitive components, ensuring optimal performance and longevity. Its durable and lightweight design makes it suitable for a variety of devices, offering superior protection in compact electronic assemblies. Ideal for use in high-power LED systems, CPU cooling, and other heat-sensitive applications, it provides reliable and efficient thermal management solutions. Characteristic: Ultra-high frequency insulating ceramic Function: Aluminum nitride thermal conductive ceramic sheet Microstructure: Single crystal Specifications and dimensions: 14*20*0.7 Insulation strength: ≥17KV/mm Manufacture country: China Instructions included: No