Universal BGA Reballing Stencil Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips

Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. 2. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature. 3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use. 4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs. 5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life. Specification: Item Type: BGA Reballing Stencil Pitch: 0.3mm0.012in, 0.35mm0.014in, 0.40.016in, 0.5mm0.020in Product Material: Stainless Steel. Package List: 1 x BGA Reballing StencilFOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.