Feature:
1. Fine Metal Locating Pillars: The BGA reballing repair fixture platform features accurate locating pillars on the base, ensuring accurate positioning and preventing the main board from shifting during operating. This design enhances stability and reliability for soldering tasks.
2. 4 In 1 Design: The planting tin platform is specifically designed for BBGA153, for BGA169 Mbga MY3 chip IC soldering stations, providing a versatile solution for soldering tasks. It includes soldering templates and fixtures for various BGA chip sizes, making it a comprehensive repair and maintenance tool kit.
3. Excellent Stainless Steel Material: Constructed from stainless steel, the BGA reballing platform offers durability and longevity for repeated use in soldering and repair tasks. The excellent material ensures stability and resistant to erosion, maintaining the platform"s performance over time.
4. Good Performance: The reballing platform BGA motherboard tool can be heated using a hot air gun, and the templates are resistant to deformation during heating. This feature ensures consistent performance and reliability when working with delicate components.
5. Multifunctional: With its accurate locating pillars, heat resistant templates, and compatibility with various BGA chip sizes, the tin platform is a secure tool for soldering, reballing, and repair tasks. It provides a stable and secure platform for accurate soldering and maintenance of electronic components, making it an essential tool for electronics enthusiasts and professionals.
Specification:
Item Type: Planting Tin Platform
Material: Stainless Steel
Application: for BBGA153, for BGA169.
Package List:
1 x Base
1 x 4 in 1 Positioning Plate
1 x Soldering Net
2 x Solder Scrape Blades
8 x Adjustment PiecesFine Metal Locating Pillars: The BGA reballing repair fixture platform features accurate locating pillars on the base, ensuring accurate positioning and preventing the main board from shifting during operating. This design enhances stability and reliabil
4 In 1 Design: The planting tin platform is specifically designed for BBGA153, for BGA169 Mbga MY3 chip IC soldering stations, providing a versatile solution for soldering tasks. It includes soldering templates and fixtures for various BGA chip sizes, ma
Excellent Stainless Steel Material: Constructed from stainless steel, the BGA reballing platform offers durability and longevity for repeated use in soldering and repair tasks. The excellent material ensures stability and resistant to erosion, maintainin
Good Performance: The reballing platform BGA motherboard tool can be heated using a hot air gun, and the templates are resistant to deformation during heating. This feature ensures consistent performance and reliability when working with delicate compone
Multifunctional: With its accurate locating pillars, heat resistant templates, and compatibility with various BGA chip sizes, the tin platform is a secure tool for soldering, reballing, and repair tasks. It provides a stable and secure platform for accur
