Rework Pad Welding- Point Repair for Phones IC- Pad for BGA- PCB

Product Description: brand new high quality Made of high quality material, durable Pad Rework-Mobile Phone IC Spot Soldering-Touch BGA-PCB Pad. Flying wire supplementary spot welding sheet mobile phone maintenance motherboard flying wire pasting pad drop point traceless repair without circle. Just peel off the protective layer, it can be used and repaired. The pads are reinforced with retaining pins and will never fall off. Improve maintenance efficiency, achieve the original pad effect & seamless. The flatness is good, which can effectively prevent the virtual welding caused by unevenness. Material: Brass Size: approx. 4.8x5.8 cm/2x2.3 inches 1 Pc equals or exceeds 100 solder points of different shapes. Package Included: 1 * Solder tab Note: 1.The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness. 2.Please allow slight manual measurement deviation for the data.